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INTEGRATED CIRCUITS
DATA SHEET
TEA1654 GreenChipTMII SMPS control IC
Product specification 2003 May 12
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
FEATURES Distinctive features * Universal mains supply operation (70 to 276 V AC) * High level of integration, giving a very low external component count. Green features * Valley or zero voltage switching for minimum switching losses * Efficient quasi-resonant operation at high power levels * Frequency reduction at low power standby for improved system efficiency (<3 W) * Cycle skipping mode at very low loads; Pi < 300 mW at no-load operation for a typical adapter application * On-chip start-up current source * Standby indication pin to indicate low output power consumption. Protection features * Safe restart mode for system fault conditions * Continuous mode protection by means of demagnetization detection (zero switch-on current) * Accurate and adjustable overvoltage protection (latched) * Short winding protection * Undervoltage protection (foldback during overload) * Overtemperature protection (latched) * Low and adjustable overcurrent protection trip level * Soft (re)start * Mains voltage-dependent operation-enabling level * General purpose input for lock protection. APPLICATIONS
TEA1654
Typical application areas are adapters and chargers (e.g. for laptops, camcorders and printers) and all applications that demand an efficient and cost-effective solution up to 250 W. GENERAL DESCRIPTION The GreenChipTM(1)II is the second generation of green Switched Mode Power Supply (SMPS) control ICs operating directly from the rectified universal mains. A high level of integration leads to a cost effective power supply with a very low number of external components. The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at reduced frequency and with valley detection. The proprietary high voltage BCD800 process makes direct start-up possible from the rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high speed protection functions and control. Highly efficient, reliable supplies can easily be designed using the GreenChipII control IC.
(1) GreenChipTM is a trademark of Koninklijke Philips Electronics N.V.
2003 May 12
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
handbook, full pagewidth
VCOadj Isense STDBY DRIVER HVS HVS DRAIN
1 2 3
14 13 12
DEM CTRL LOCK VCC(5V) GND n.c. VCC
4 TEA1654T 11 5 6 7 10 9 8
MDB218
Fig.1 Basic application.
ORDERING INFORMATION TYPE NUMBER TEA1654T PACKAGE NAME SO14 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm VERSION SOT108-1
2003 May 12
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
BLOCK DIAGRAM
TEA1654
handbook, full pagewidth
VCC 8 SUPPLY MANAGEMENT START-UP CURRENT SOURCE clamp internal supply 10 S1 M-level VOLTAGE CONTROLLED OSCILLATOR LOGIC 100 mV 3 OVERVOLTAGE PROTECTION UVLO start VALLEY 5, 6 14 HVS DEM 7 DRAIN
GND
STDBY
FREQUENCY CONTROL
VCOadj
1
LOGIC
DRIVER Iss
4
DRIVER
CTRL
13
POWER-ON RESET -1 UVLO
LEB S Q blank R Q soft start S2
0.5 V
2
TEA1654T
MAXIMUM ON-TIME PROTECTION
OCP
Isense
12 LOCK 300 2.5 V 5.6 V lock detect OVERTEMPERATURE PROTECTION S Q short winding 0.88 V 11 OVER-POWER PROTECTION 9 n.c.
MDB213
VCC < 4.5 V
R
Q 5 V/1 mA (max)
VCC(5V)
Fig.2 Block diagram.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
PINNING SYMBOL PIN VCOadj Isense STDBY DRIVER HVS HVS DRAIN VCC n.c. GND VCC(5V) LOCK CTRL DEM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DESCRIPTION VCO adjustment input programmable current sense input standby indication or control output gate driver output high voltage safety spacer, not connected high voltage safety spacer, not connected drain of external MOS switch, input for start-up current and valley sensing supply voltage not connected ground 5 V output lock input control input input from auxiliary winding for demagnetization timing, OVP and OPP FUNCTIONAL DESCRIPTION
TEA1654
The TEA1654 is the controller of a compact flyback converter, with the IC situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up. The TEA1654 operates in multi modes (see Fig.4). The next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of primary inductance and drain capacitor ensures this quasi-resonant operation. The design can be optimized in such a way that zero voltage switching can be reached over almost the complete universal mains range. To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control. At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 24 kHz. Start-up, mains enabling operation level and undervoltage lock-out (see Figs 11 and 12) Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN. Supply capacitor CVCC is charged by the internal start-up current source to a level of approximately 4 V (or higher, this is dependent on the drain voltage/M-level). Once the drain voltage exceeds the M-level (mains-dependent operation-enabling level), the start-up current source will continue charging capacitor CVCC (switch S1 will be opened); see Fig.2. The IC will activate the power converter as soon as the voltage on pin VCC passes the level VCC(start). The IC supply is taken over by the auxiliary winding as soon as the output voltage reaches its intended level and the IC supply from the mains voltage is subsequently stopped for high efficiency operation (green function). The moment the voltage on pin VCC drops below the undervoltage lock-out level VUVLO, the IC stops switching and enters a safe restart from the rectified mains voltage. Inhibiting the auxiliary supply by external means causes the converter to operate in a stable safe restart mode. Supply management
handbook, halfpage
VCOadj 1 Isense 2 STDBY 3 DRIVER 4 HVS 5 HVS 6 DRAIN 7
MDB216
14 DEM 13 CTRL 12 LOCK
TEA1654T 11 VCC(5V)
10 GND 9 8 n.c. VCC
Fig.3 Pin configuration.
All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
The maximum fixed frequency of the oscillator is set by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changes linearly with the control voltage until the minimum frequency is reached (see Figs 5 and 6).
f
handbook, halfpage (kHz)
MDB217
VCO 65
fixed
quasi resonant
24 P (W)
handbook, halfpage f
MCE407
(kHz) 65
Fig.4 Multi mode operation.
24
Current mode control Current mode control is used for its good line regulation behaviour. The `on-time' is controlled by the internally inverted control pin voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on. The internal control voltage is inversely proportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from 0.5 to 0 V (a high external control voltage results in a low duty cycle). Oscillator
VCO2 level VCO1 level Vsense(max) (V)
Fig.6 VCO frequency as a function of Vsense(max).
VCO adjustment The VCOadj pin can be used to set the VCO operation point. As soon as the peak voltage on the sense resistor is controlled below half the voltage on the VCOadj pin (VCO1 level), frequency reduction will start. The actual peak voltage on sense will be somewhat higher due to switch-off delay (see Fig.7). The frequency reduction will stop approximately 25 mV lower (VCO2 level), when the minimum frequency is reached. Cycle skipping At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 24 kHz. If the voltage on the control pin has raised even more, switch-on of the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.7). For system accuracy, it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used.
sense(max) handbook, halfpage
V
MGU233
0.52 V
1V (typ)
1.5 V (typ)
VCTRL
Fig.5 Vsense(max) as a function of VCTRL.
Remark: If the no-load requirement of the system is such that the output voltage can be regulated to its intended level at a switching frequency of 24 kHz or above, the cycle skipping mode will not be activated.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
handbook, full pagewidth
fosc current comparator DRIVER DRIVER Isense fmin dV3 dV4 VCOadj 5 Vx (mV) dV2 fmax dV1
1.5 V - VCTRL CTRL
VCC(5V) 5V VCOadj
X2 Vx V I OSCILLATOR
VSTDBY (V)
0
MDB219
cycle skipping
Vx (mV)
1
0 Vx (mV) The voltage levels dV1, dV2, dV3 and dV4 are fixed in the IC to typically 50 mV, 18 mV, 40 mV and 15 mV respectively. The level at which VCO mode of operation starts or ends can be controlled externally with the VCOadj pin.
Fig.7 A functional implementation of the standby and cycle skipping circuitry.
Standby output The STDBY output pin (VSTDBY = 5 V) can be used to drive an external NPN transistor or FET in order to e.g. switch-off a PFC circuit. The STDBY output is activated by the internal VCO: as soon as the VCO has reduced the switching frequency to (almost) the minimum frequency of 24 kHz, the STDBY output will be activated (see Fig.7). The STDBY output will go low again as soon as the VCO allows a switching frequency close to the maximum frequency of 65 kHz. Demagnetization The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended. Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power level. 2003 May 12 7
Demagnetization recognition is suppressed during the first time (tsuppr). This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages/start-up. OverVoltage Protection (OVP) An OVP mode is implemented in the GreenChip series. For the TEA1654, this works by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter. If the output voltage exceeds the OVP trip level, the OVP circuit switches off the power MOSFET. The controller then waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level, however the IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc.
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Operation only recommences when the VCC voltage drops below a level of approximately 4.5 V (practically when the Vmains has been disconnected for a short period). The output voltage (VOVP) at which the OVP function trips, can be set by the demagnetization resistor RDEM: Ns V OVP = ----------- x [ I OVP ( DEM ) x R DEM + V clamp ( DEM ) ( pos ) ] N aux where Ns is the number of secondary turns and Naux is the number of auxiliary turns of the transformer. Current IOVP(DEM) is internally trimmed. The value of the demagnetization resistor (RDEM) can be adjusted to the turns ratio of the transformer, thus making an accurate OVP possible. Valley switching (see Fig.8)
TEA1654
A new cycle starts when the power switch is switched on. After the `on-time' (which is determined by the `sense' voltage and the internal control voltage), the switch is opened and the secondary stroke starts. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately 1 -----------------------------------------2 x x Lp x Cd where Lp is the primary self inductance of the transformer and Cd is the capacitance on the drain node.
handbook, full pagewidth
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.8 Signals for valley switching.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for the lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 8 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the oscillator signal. In an optimum design, the reflected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is very possible, preventing large 1 2 capacitive switching losses P = -- x C x V x f , and 2 allowing high frequency operation, which results in small and cost effective inductors. OverCurrent Protection (OCP) The cycle-by-cycle peak drain current limit circuit uses the external source resistor to measure the current accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time tleb. The OCP protection circuit limits the `sense' voltage to an internal level. OverPower Protection (OPP) During the primary stroke, the rectified mains input voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according V aux N x V mains to the following formula: I DEM -------------- -------------------------R DEM R DEM N aux where: N = ----------Np The current information is used to adjust the peak drain current, which is measured via pin Isense. The internal compensation is such that an almost mains independent maximum output power can be realized. The OPP curve is given in Fig.9.
-100 A (typ) IDEM -24 A (typ)
TEA1654
handbook, halfpage
MCE406
Vsense(max) 0.52 V (typ)
0.3 V (typ)
Fig.9 OPP correction curve.
Minimum and maximum `on-time' The minimum `on-time' of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the `on-time' to 50 s. When the system desires an `on-time' longer than 50 s, a fault condition is assumed, and the IC will stop switching and enter the safe restart mode. Short winding protection After the leading edge blanking time, the short winding protection circuit is also activated. If the `sense' voltage exceeds the short winding protection voltage Vswp, the converter will stop switching. Once VCC drops below the UVLO level, capacitor CVCC will be recharged and the supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode). The short winding protection will also protect in case of a secondary diode short-circuit.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
LOCK input Pin LOCK is a general purpose (high-impedance) input pin, which can be used to switch off the IC. As soon as the voltage on this pin is raised above 2.5 V, switching will stop immediately. The voltage on the VCC pin will cycle between VCC(start) and VCC(UVLO), but the IC will not start switching again until the latch function is reset. The latch is reset as soon as the VCC drops below 4.5 V (typical value). The internal OVP and OTP will also trigger this latch (see Fig.2). The detection level of this input is related to the VCC(5V) pin voltage in the following way: 0.5 x VCC(5V) 4%. An internal Zener diode clamp of 5.6 V will protect this pin from excessive voltages. No internal filtering is done on this input. OverTemperature Protection (OTP) An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will stop switching. When VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level, however the IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommences when the VCC voltage drops below a level of approximately 4.5 V (practically when the Vmains has been disconnected for a short period). Soft start-up To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin Isense and the sense resistor (see Fig.10). An internal current source charges the capacitor to V = ISS x RSS, with a maximum of approximately 0.5 V. The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS. V ocp - ( I SS x R SS ) I primary(max) = ---------------------------------------------R sense = R SS x C SS The charging current ISS will flow as long as the voltage on pin Isense is below approximately 0.5 V. If the voltage on pin Isense exceeds 0.5 V, the soft start current source will start limiting the current ISS. At the VCC(start) level, the ISS current source is completely switched off. 2003 May 12 10
TEA1654
Since the soft start current ISS is subtracted from pin VCC charging current, the RSS value will affect the VCC charging current level by a maximum of 60 A (typical value).
handbook, halfpage
ISS
0.5 V
start-up 2 Isense RSS
Vocp
CSS
Rsense
MCE405
Fig.10 Soft start-up.
5 V output Pin VCC(5V) can be used for supplying external circuitry. The maximum output current must be limited to 1 mA. If higher peak currents are required, an external RC combination should limit the current drawn from this pin to 1 mA maximum. The 5 V output voltage will be available as soon as the start-up voltage is reached. As the high voltage supply can not supply the 5 V pin during start-up and/or shutdown, during latched shutdown (via pin LOCK or other latched protection such as OVP or OTP), the voltage is switched to zero. Driver The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 170 mA and a current sink capability of typically 700 mA. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen to limit the V/t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense.
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL Voltages VVCOadj Vsense VDRAIN VCC VLOCK VCTRL VDEM Currents Isense ISTDBY IDRIVER IDRAIN ICC(5V) ICTRL IDEM General Ptot Tstg Tj ESD Vesd electrostatic discharge voltage pins 1 to 6 and pins 9 to 14 pin 7 any other pin Notes HBM class 1; note 2 HBM class 1; note 2 MM; note 3 - - - 2000 1500 400 total power dissipation storage temperature junction temperature Tamb < 70 C - -55 -20 0.75 +150 +145 current on pin Isense current on pin STDBY current on pin DRIVER current on pin DRAIN current on pin VCC(5V) current on pin CTRL current on pin DEM d < 10% -1 -1 -0.8 - -1 - -250 +10 - +2 +5 0 +5 +250 voltage on pin VCOadj voltage on pin Isense voltage on pin DRAIN supply voltage voltage on pin LOCK voltage on pin CTRL voltage on pin DEM current limited continuous continuous continuous current limited -0.4 -0.4 -0.4 -0.4 -0.4 -0.4 -0.4 +5 - +650 +20 +7 +5 - PARAMETER CONDITIONS MIN.
TEA1654
MAX.
UNIT
V V V V V V V
mA mA A mA mA mA A W C C
V V V
1. All voltages are measured with respect to ground; positive currents flow into the chip; pin VCC must not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. 2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. With pin GND connected to sufficient copper area on the printed-circuit board. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air; note 1 VALUE 100 UNIT K/W
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
QUALITY SPECIFICATION In accordance with "SNW-FQ-611D".
TEA1654
CHARACTERISTICS Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Start-up current source (pin DRAIN) IDRAIN supply current from pin DRAIN VCC = 0 V; VDRAIN > 100 V with auxiliary supply; VDRAIN > 100 V BVDSS M-level breakdown voltage mains-dependent operation-enabling level 1.0 - 650 60 1.2 100 - - 1.4 300 - 100 mA A V V
Supply voltage management (pin VCC) VCC(start) VCC(UVLO) VCC(hys) ICC(h) ICC(l) ICC(restart) ICC(oper) start-up voltage on VCC undervoltage lock-out on VCC hysteresis voltage on VCC pin VCC charging current (high) pin VCC charging current (low) pin VCC restart current supply current under normal operation VCC(start) - VCC(UVLO) VDRAIN > 100 V; VCC < 3V VDRAIN > 100 V; 3 V < VCC < VCC(UVLO) 10.3 8.1 2.0 -1.2 -1.2 11 8.7 2.3 -1 -0.75 -550 1.3 11.7 9.3 2.6 -0.8 V V V mA
-0.45 mA -450 1.5 A mA
VDRAIN > 100 V; -650 VCC(UVLO) < VCC < VCC(start) no load on pin DRIVER 1.1
Demagnetization management (pin DEM) Vth(DEM) IDEM demagnetization comparator threshold voltage on pin DEM pin DEM current VDEM = 50 mV IDEM = 250 A 50 100 150 0 0.9 1.9 mV nA V s
-50(1) - -0.5 0.5 1.1 -0.25 0.7 1.5
Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = -150 A Vclamp(DEM)(pos) positive clamp voltage on pin DEM tsuppr suppression of transformer ringing at start of secondary stroke
-0.05 V
Pulse width modulator ton(min) ton(max) Oscillator fosc(l) fosc(h) VVCO(start) oscillator low fixed frequency oscillator high fixed frequency peak voltage on pin Isense, where frequency reduction starts VCTRL > 1.5 V VCTRL < 1 V see Figs 6 and 7 19 50 - 24 63 VCO1 29 75 - kHz kHz mV minimum on-time maximum on-time latched - 40 tleb 50 - 60 ns s
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
SYMBOL VVCO(max)
PARAMETER peak voltage on pin Isense, where the frequency is equal to fosc(l) minimum voltage on pin CTRL for maximum duty cycle maximum voltage on pin CTRL for minimum duty cycle
CONDITIONS
MIN. -
TYP. VCO1 - 25
MAX. UNIT - mV
Duty cycle control (pin CTRL) VCTRL(min) VCTRL(max) - - 1.0 1.5 - - V V
5 V output (pin VCC(5V)) VCC(5V) ICC(5V) VLOCK VCC(reset) RELLOCK,5V V/tvalley tvalley-swon output voltage current capability of pin VCC(5V) LOCK trip level voltage level on pin VCC which resets the latch relation to 5 V output (pin VCC(5V)) valley recognition voltage change delay from valley recognition to switch-on V/t = 0.1 V/s V/t = 0.5 V/s VLOCK < 2.3 V VLOCK = 0.5 x VCC(5V) IO = 1 mA 4.75 -1.0 2.37 - -4 -85 - 5.0 - 2.5 4.5 - - 150(1) 5.25 - 2.63 - +4 +85 - V mA
LOCK input (pin LOCK) V V %
Valley switch (pin DRAIN) V/s ns
Overcurrent and short winding protection (pin Isense) Vsense(max) tPD Vswp tleb ISS IOVP(DEM) maximum source voltage OCP propagation delay from detecting Vsense(max) to switch-off short winding protection voltage blanking time for current and short winding protection soft start current Vsense < 0.5 V set by resistor RDEM; see Section "OverVoltage Protection (OVP)" 0.48 - 0.83 300 45 0.52 140 0.88 370 60 0.56 185 0.96 440 75 V ns V ns A A
Overvoltage protection (pin DEM) OVP level on pin DEM 54 60 66
Overpower protection (pin DEM) IOPP(DEM) OPP current on pin DEM to start OPP correction OPP current on pin DEM, where maximum source voltage is limited to 0.3 V set by resistor RDEM; see Section "OverPower Protection (OPP)" - -24 - A
IOPP50%(DEM)
-
-100
-
A
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Standby output (pin STDBY) VSTDBY Isource Isink Isource Isink standby output voltage source current capability sink current capability VSTDBY = 1.5 V VSTDBY = 1.5 V 4.75 20 2 5.0 22 - -170 300 700 11.5 5.25 24 - -88 - - 12 V A mA
Driver (pin DRIVER) source current capability of driver sink current capability of driver VCC = 9.5 V; VDRIVER = 2 V - VCC = 9.5 V; VDRIVER = 2 V - VCC = 9.5 V; VDRIVER = 9.5 V Vo(driver)(max) Tprot(max) Tprot(hys) Note 1. Guaranteed by design. maximum output voltage of driver VCC > 12 V Temperature protection maximum temperature protection level hysteresis for the temperature protection level 130 - 140 8(1) 150 - C C 400 - mA mA mA V
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
APPLICATION INFORMATION
TEA1654
A converter with the TEA1654 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit. Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the maximum primary peak current.
handbook, full pagewidth
Vmains PFC Vi Do Vo
VCC CVCC n.c. GND VCC(5V) -t LOCK CTRL CCTRL DEM RCTRL
8 9 10
7 6 5
DRAIN HVS HVS DRIVER STDBY Isense VCOadj Rs2 CSS RSS Rsense
Np
Ns Co
power MOSFET
11 TEA1654T 4 12 13 14 3 2 1
RDEM Naux
Rreg1
Rreg2
MDB214
The LOCK pin is used in this example for an additional external overtemperature protection. If this pin is not used, it must be tied to ground.
Fig.11 Configuration with controlled PFC.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1654
handbook, full pagewidth
Vi
VD (power MOSFET)
Vo
VCC
Vgate
M-level
VC
start-up sequence
normal operation
overvoltage protection
normal operation
output short-circuit
MBL505
Fig.12 Typical waveforms.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm
TEA1654
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferably be kept: * below 220 C for all the BGA packages and packages with a thickness 2.5mm and packages with a thickness <2.5 mm and a volume 350 mm3 so called thick/large packages * below 235 C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TEA1654
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3)
TEA1654
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS3(3) Development DEFINITION
TEA1654
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
NOTES
TEA1654
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
NOTES
TEA1654
2003 May 12
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
NOTES
TEA1654
2003 May 12
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/01/pp24
Date of release: 2003
May 12
Document order number:
9397 750 11186

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